Electronic Assembly UV-Curing Adhesives

Electronic Assembly UV-Curing Adhesives

Yangfan electronic assembly UV-Curing adhesives are suitable for precise electronic assembly fields such as chip packaging, PCB bonding, and sensor protection. They feature second-level curing, high precision, high temperature resistance, and low shrinkage, ensuring the reliability of electronic devices.
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Product Description

Product

Viscosity
(25℃ mPa.s)

Shore hardness

Tensile at Break(MPa)

Elongatlon at break(%)

Features

YF-D913

75

D40

8

150

● Isocyanate free
● Flexible and bendable

YF-D901

2000

D90

25

20

● High bond strength on nickel 
● Secondary heat curie for shadow areas

YF-D904

500

D87

23

40

● Black coating for covering sensitive information

YF-D915

4000

D85

18

5

● Yellowing resistance

YF-D928

350

D80

20

30

● Low yellowing
● Extreme low curing stress 

YF-D921

5000

D85

15

80

● Flame retardant UL 94V-0 

YF-D935

24000

D57

12

150

● Reinforce the chip or the electronic part on PCB wires

YF-D933

70000

D38

6

180

● Reinforce the chip or parts
● Good adhesion on plastics

Storage and Handling
• Maximum shelf life of six months if left in an unopened container and stored at 25°C.
• Sensitive to UV/Visible light. Therefore, material should always be stored in tightly sealed, UV-resistant
containers away from sunlight and under cool dry conditions.
• For industrial use only. Users should review the Safety Data Sheet (SDS) prior to handling.

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